Command & data handling

Our ICs manage data from spacecraft sensors, can execute commands, and enable communication between subsystems.

Communications payload

Signal processing, modulation, and transmission between spacecraft and ground stations. Our ICs ensure stable clock generation with competitive performance and high integration levels. Designed to withstand space conditions, they ensure robust and efficient communication throughout the mission.

Optical imaging payload

When it comes to processing images from sensors, handling data compression, and managing storage for transmission back to Earth, our ICs are designed to create images in the toughest environments.

Attitude Determination & Control System (ADCS)

Process sensor data to determine spacecraft orientation and control actuators for precise maneuvering, ensuring reliable and accurate control in the harsh conditions of space.

LIDAR

Our patented Time-to-Digital Converter (TDC) technology processes signals from lasers to generate ultra-precise 3D maps and detect objects with unparalleled accuracy. With our advanced TDC solutions, we set new benchmarks for precision mapping and object detection in space exploration and beyond.

2D spectroscopy

Our patented Time-to-Digital Converter (TDC) solutions excel in managing data collection from detectors, processing spectral information, and controlling the timing and synchronization of measurements. Designed to perform under the extreme conditions of space, our technology ensures precise and reliable data handling, enabling advanced performance for critical applications in space exploration.

Remote terminal units

Our products manage data acquisition, processing, and communication between spacecraft subsystems and ground control, ensuring reliable operation and data integrity in the harsh conditions of space.

Your next challenge...

Our team is eager to assist and customize solutions to meet your needs based on our expertise in the space industry and our proprietary radiation-hardening-by-design methodology.
Enquiries
Magics’ capacity to support subsystem-level scientific exploration extends from Earth observation to the exploration of the moons, planets, comets, and asteroids of our own solar system, and into the universe beyond.
As space missions begin to transition from exploration to become more standardised and mission-specific, there is a growing requirement for performance and weight reductions in satellite constellations, landers and, rovers.

In all industries CMOS technology has been key for standardisation, size and cost reduction and that is exactly what Magics is addressing at the long term for the growing amount of applications in the space domains.

Discover how Magics’ technologies can deliver solutions to the following challenges and securing youre our supply chain. If your current challenge is not listed below, we are eager to discuss how we can develop a bespoke solution to perfectly meet your needs.

Cases

MAG
IMG001X1-NC
Full HD radiation-hardened CMOS image sensor with 1 MGy TID tolerance.
Vision Series
Key features
Sensor parameters

CMOS imager sensor with >2 Mpixel:

  • 5 μm pixel size
  • Electronic rolling shutter
  • > 60dB dynamic range
  • Mono and color version available
Resolution

1920 x 1080 with a programmable frame rate up to 40 FPS in Full HD mode

Video interface

Parallel CMOS 10/12b interface

Features
  • On-chip sequencer and clock generation
  • Programmable integration time
  • Video and trigger modes
  • Sub-sampling
  • Dark pixel readout option
Communication interface

SPI slave interface (interface with MAG-CXP00002-NP)

Power Supply

3.3V and 1.8V

Operating temperature

0 to 85°C junction

MAG
PLL00002
A rad-hard fully integrated frequency synthesizer for digital clocking and RF applications in space.
Time Series
Key features
Output frequency

1 MHz – 5 GHz

Phase noise

123dBc/Hz at 1MHz (with 2.5GHz carrier)

Integrated jitter

<200 fs

Power consumption

200 mW typ

Output

4x <1GHz driver 1.8 V – 3.3 V
LVDS/LVCMOS/CML/LVPECL

RF output

2x 1-5GHz RF driver 2.5 V – 3.3 V DC-CML, AC CML/LVDS/LVPECL

MAG
POS00002-NP
Radiation-hardened resolver - and LVDT-to-digital converter with 16-bit resolution for position sensing.
Motion Series
Key features
Resolution

HR (16-bit) position & velocity acquisition

Sampling speed

Up to 40 kHz

Calibration options

Offset and gain

Clocking options and communications

On-Chip oscillator or automatic switch-over to external clock

Self-test

Built-in

Communication interface

SPI interface

Power supply

Single 1.25 V

Operating temperature

-40°C to 125°C

Additional features

Device redundancy capability
On-Chip analog temperature sen

MAG
PSU00001-NP
Radiation-hardened single-phase synchronous step-down bulk converter developed to provide an efficient solution for power distribution in harsh radiation and magnetic field environment
Power Series
Key features
Input voltage

5 to 11 V

Programmable output voltage

0.9 to 5 V

Load capability

Continuous 4A load capability (with active cooling)

Topology

Synchronous Buck with continuous mode operation

High bandwidth feedback loop

(150 kHz) for good transient performance

Protection features

Over-current & over-temperature

Operating temperature

-40°C to 125°C

MAG
MSW00002-NP
Radiation-hardened 10-channel limit switch and optocoupler readout chip.
Motion Series
Key features
Input voltage

up to 48 V

Channels

10-channel limit switch read-out

Self-test

Built-in 

Communication interface

SPI interface

Power supply

Single 3.3 V

Operating temperature

-40°C to 125°C

MAG
TDC00002
Radiation-hardened single shot Time-to-Digital Converter for high precision and accurate time measurements.
Time Series
Key features
Resolution

Single-Shot precision < 8ps

Zero dead-zone

0 ps to 3 s

Additional features

Multi-stop mode up to 5 pulses

Supplies

1.2V core and 1.8-3.3V IO voltage

Power consumption

20 mW typ

MAG
DRV00002-NP
Radiation-hardened octal low-side driver with embedded PWM control functionality.
Motion Series
Key features
Number of channels and drive strength

8-individual low-side HV FETs drivers: 125 mA per driver max. switching of 40 kHz

Switching supply rail

up to 48 V

Communication interface

SPI interface

Power supply

Single 3.3 V supply

Operating temperature

-40°C to 125°C

MAG
BUS00002-NP
Radiation-hardened BiSS slave communication device with onchip SPI master and interfacing capabilities to four SPI slaves.
Motion Series
Key features
Core performance parameters

BISS serial comm slave device RS-422 PHY interface 4Mbit/s over 200m cable multiple MAG-BUS in daisy chain connection

Self-test

Built-in

Communication interface

BISS to SPI bridge: bidirectional BiSS Slave SPI interface Master (4 SPI slave ICs connection per MAG-BUS IC)

Power supply

1.25 V and 3.3 V

Operating temperature

-40°C to 125°C

MAG
SEI00002-NP
Radiation-hardened generic signal conditioning chip to readout resistive sensors.
Motion Series
Key features
Function

4-channel differential sensor readout

Resolution

ADC (16-bit)

Additional features

On-chip sensor excitation (voltage or current)

Self-test

Built-in

Communication interface

SPI interface

Power supply

Single 1.25 V supply

Operating temperature

-40°C to 125°C